Reliability of Bonded Interfaces
The advent of wide-bandgap (WBG) devices has pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of WBG devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver offers a lot of promise to be used as a bonded interface material in packages at higher temperatures. However, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms are not well understood. Through this project, we seek to study the failure pattern of sintered silver under thermal loads and establish a model that predicts its lifetime. Better geometric designs of interface attachment area to prevent failures will also be investigated.
last modified Nov 02, 2015 08:27 AM